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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
At the rack level, AI training clusters are now so dense that the thermal ceiling, not compute power, is what limits ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
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