A tough challenge for test engineers is explored in terms of test methods, pitfalls, and measurement errors. For the test engineer, RF and microwave power amplifier testing imposes unique challenges.

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

5G technology has led to the introduction of a significant number of new RF features that need to be implemented in mobile networks while considering stringent constraints in board space and power ...

As chip designs push the limits of speed, size and complexity, the semiconductor industry has set its sights on angstrom-scale device features. High-speed, precise and repeatable plasma power delivery ...

The year 1981 was notable for a variety of technology breakthroughs. It saw the inaugural mission of the Space Shuttle Columbia and the debut of the DeLorean car. The IBM PC, Commodore 64, and the ...